無氰化合物鎂合金表面電沉積銅鍍層之水溶液組成及方法

Translated title of the contribution: A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface

Ching-An Huang (Inventor), GUANG-LIANG CHEN (Inventor), ZONG-XIN WANG (Inventor)

Research output: Patent

Abstract

The invention relates a composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface. The surface of magnesium alloy is electrodeposited with conductive copper layer in an alkaline cupric sulfate bath and then is done with a thickness treatment of copper layer in a merchant cupric sulfate bath resulting in the surface having corrsition resistance, wear resistance and brightness. A pretreatment is fairly simple. The pretreatment composition is without HF and CrO3 and hypertoxic cyanide-free compound. Thus, effluent standards of water pollution effluent standards are easily met and the working safety for operators is enhanced. The invention is highly valuable in industrial application.
Translated title of the contributionA composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface
Original languageChinese (Traditional)
Patent numberI322200
IPCC25D-003/38(2006.01);C25D-021/14(2006.01)
StatePublished - 21 03 2010

Bibliographical note

公開公告號: I322200
Announcement ID: I322200

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