Skip to main navigation Skip to search Skip to main content

無氰化合物鎂合金表面電沉積銅鍍層之水溶液組成及方法

Translated title of the contribution: A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface
  • Ching-An Huang (Inventor)
  • , GUANG-LIANG CHEN (Inventor)
  • , ZONG-XIN WANG (Inventor)

Research output: Patent

Abstract

The invention relates a composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface. The surface of magnesium alloy is electrodeposited with conductive copper layer in an alkaline cupric sulfate bath and then is done with a thickness treatment of copper layer in a merchant cupric sulfate bath resulting in the surface having corrsition resistance, wear resistance and brightness. A pretreatment is fairly simple. The pretreatment composition is without HF and CrO3 and hypertoxic cyanide-free compound. Thus, effluent standards of water pollution effluent standards are easily met and the working safety for operators is enhanced. The invention is highly valuable in industrial application.
Translated title of the contributionA composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface
Original languageChinese (Traditional)
IPCC25D-003/38(2006.01);C25D-021/14(2006.01)
StatePublished - 16 11 2006

Bibliographical note

公開公告號: 2.00639279E8
Announcement ID: 2.00639279E8

Fingerprint

Dive into the research topics of 'A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface'. Together they form a unique fingerprint.

Cite this