熱電分離之發光二極體基板結構

A light-emitting-diode (LED) substrate structure having heat/electricity separation capability. Wherein, an LED carrier plate having at least an LED die is provided. The bottom of the carrier plate is connected to an eutectic layer, so the heat generated during operations of LED die is dissipated downward through the eutectic layer. A substrate is provided on the LED carrier plate, and the substrate is provided with a first conduction layer connected electrically to the LED carrier plate. As such, the power supply driving the LED die to operate is transferred through the first conduction layer on the substrate to the LED carrier plate, to achieve heat/electricity separation of the carrier plate, and having advantages of electricity conduction and heat dissipation of LED.