| Translated title of the contribution | Thermal Deformation Analysis of Heterogeneous Integration Substrate and its Flip-Chip Packages by Experiment and Simulation |
|---|---|
| Original language | Chinese (Traditional) |
| Supervisors/Advisors |
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| State | Published - 2022 |
| Externally published | Yes |
異質整合基板與其覆晶構裝體之熱翹曲分析：實驗與模擬
唐瑩真
Research output: Types of Thesis › Master's thesis