發光二極體之電鑄製造方法

The present invention provides an electroforming fabrication method of light emitting diodes (LED), which includes the following steps: providing a substrate with a plurality of epitaxial layers and metal layers with completed patterning; forming an insulation layer on the top surface of the epitaxial layers and on the side walls of patterned metal layers; next, employing the electroforming process of the electroforming processing device to form a support heat dissipation layer of metal material with suitable thickness; dicing the substrate to obtain a plurality of LED dies; using the flip-chip technique to mount the LEDs on a carrying substrate; finally, employing laser beam to peel off from the substrate. Thus, the present invention may solve the problem of the conventional technique that the fabrication method using underfill causes the slow processing speed, and may provide required support force in the process of laser peeling substrate, and further achieve high heat dissipation effect.