研究線負載於彈性基礎測試法用於評估薄矽晶片之彎曲強度並與三點彎曲測試法比較

Translated title of the contribution: Investigation on the bending strength of silicon dies in the LoEF test and its comparison with the 3PB test

謝博任

Research output: Types of ThesisMaster's thesis

Translated title of the contributionInvestigation on the bending strength of silicon dies in the LoEF test and its comparison with the 3PB test
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2025
Externally publishedYes

Cite this