表面黏著型式記憶體插槽接合於印刷電路板之熱變形量測與分析

Translated title of the contribution: Analysis and Measurement of Thermal Deformation of DIMM Socket-PCB Assembly

陸彥睿

Research output: Types of Thesis › Master's thesis

Translated title of the contributionAnalysis and Measurement of Thermal Deformation of DIMM Socket-PCB Assembly
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2020
Externally publishedYes

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