Skip to main navigation Skip to search Skip to main content

覆晶構裝體受熱負載之力學行為研究

Translated title of the contribution: Investigation of Thermo-Mechanical Behaviors of Flip Chip BGA in IC Packaging
  • 許俊宏

Research output: Types of Thesis › Master's thesis

Translated title of the contributionInvestigation of Thermo-Mechanical Behaviors of Flip Chip BGA in IC Packaging
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2002
Externally publishedYes

Access to Document

Cite this