評估2.5D構裝體之矽穿孔中介層之結構熱變形與強度

Translated title of the contribution: Evaluation of Thermal Deformation and Strength of Silicon Interposer Used in 2.5D IC Package

劉桓吟

Research output: Types of Thesis › Master's thesis

Translated title of the contributionEvaluation of Thermal Deformation and Strength of Silicon Interposer Used in 2.5D IC Package
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2016
Externally publishedYes

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