銅柱接點式覆晶構裝體受熱負載下之熱應力與熱變形：分析與量測

Translated title of the contribution: Thermal Stresses and Deformations of Cu Pillar-Flip Chip BGA Package: Analyses and Measurements

周佳仁

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Stresses and Deformations of Cu Pillar-Flip Chip BGA Package: Analyses and Measurements
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2010
Externally publishedYes

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