雷射干涉法應用於IC封裝材料結構的熱變形分析

Translated title of the contribution: Thermal Deformation Measurements of Electronic Packaging Structures Using Laser Interferomertic Systems

蔣文琪

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Deformation Measurements of Electronic Packaging Structures Using Laser Interferomertic Systems
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2000
Externally publishedYes

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