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電子封裝載板之熱變形與翹曲研究：實驗與模擬

Translated title of the contribution: Thermally-Induced Warpage and Deformation of IC Packaging Substrates : Experimental and Numerical Studies
  • 林辰諺

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermally-Induced Warpage and Deformation of IC Packaging Substrates : Experimental and Numerical Studies
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2023
Externally publishedYes

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