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電子構裝體於面陣列製程下所引起之變形分析

Translated title of the contribution: MAP Process-Induced Deformation In Electronic Packages
  • 潘虹君

Research output: Types of Thesis › Master's thesis

Translated title of the contributionMAP Process-Induced Deformation In Electronic Packages
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2002
Externally publishedYes

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