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電鍍參數與添加劑對銅結晶之影響

Translated title of the contribution: Influence of the Electroplating Parameters and Additives on the Copper Electocrystallization
  • 李公正

Research output: Types of Thesis › Master's thesis

Translated title of the contributionInfluence of the Electroplating Parameters and Additives on the Copper Electocrystallization
Original languageChinese (Traditional)
Supervisors/Advisors
  • Huang, Ching-An, Supervisor
StatePublished - 2001
Externally publishedYes

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