高散熱之疊／覆晶式發光二極體

A high heat dissipation chip-on-chip/ flip-chip LED is to mount LED units to a dissipation substrate in a chip-on-chip or flip-chip technology. The plurality of through holes is made on the heat dissipation substrate and is filled in heat conductive materials to form a plurality of heat conductive posts which improve the heat dissipation capability of the heat dissipation substrate. Therefore, the heat generated from LED units can be easily dissipated through the high heat conductivity of the conductive posts to achieve a high light output, improve the unit's stability, extend the unit's service lifetime and promote the unit's miniaturization and lower price.