Abstract
The present invention discloses a high heat-dissipation light emitting diode package module for providing multiple heat-dissipation paths. With the special structure, heat-conduction film and fluid in the module of the present invention, the heat generated by the light emitting diodes can be dissipated outwardly through multiple paths. In addition, the flip chip technology is used with a transparent substrate in a three-dimensional stack manner to increase the color rendering index and beam angle of the mixed white light of the light emitting diodes. Furthermore, in this invention, there is no need to provide a silica gel or epoxy resin package protection on the surface of the light emitting diodes, so as to achieve the effect of simplifying the package. The vertical stack enables the light emitting diodes in performing light mixture to increase the color rendering index by means of vertical penetration. The light emitting diodes with different color temperatures can be operated using different control power source, so as to generate not only the white light but also various color temperatures by means of regulating the power source.
| Translated title of the contribution | High heat-dissipation light emitting diode package module |
|---|---|
| Original language | Chinese (Traditional) |
| Patent number | I619273 |
| IPC | H01L 33/64(2010.01); H01L 33/50(2010.01) |
| State | Published - 21 03 2018 |
Bibliographical note
公開公告號: I619273Announcement ID: I619273