Abstract
A high-throughput colloid unit forming mold and a method thereof are disclosed in this invention. The colloid unit forming mold contains a flexible layer and a mold layer. The mold layer is bonded onto the flexible layer and has at least a mold cavity for adding glue liquid therein. After the glue liquid is condensed into a colloid unit, external force is imposed on the flexible layer to separate the colloid unit from the mold cavity. The high-throughput colloid unit forming mold and method in this invention uses a flexible layer in cooperation with a mold layer to produce a colloid unit with efficacies of high throughput, rapid manufacturing, accurate quantification, cost saving and convenience of operation.
| Translated title of the contribution | High-throughput colloid unit forming mold and method |
|---|---|
| Original language | Chinese (Traditional) |
| Patent number | I361133 |
| IPC | B29C-033/50(2006.01);G01N-033/50(2006.01) |
| State | Published - 01 04 2012 |
Bibliographical note
公開公告號: I361133Announcement ID: I361133