2.4 kV Vertical GaN PN Diodes on Free Standing GaN Wafer Using CMOS-Compatible Contact Materials

Xinke Liu, Hsien Chin Chiu*, Hou Yu Wang, Cong Hu, Hsiang Chun Wang, Hsuan Ling Kao, Feng Tso Chien

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

11 Scopus citations

Abstract

This paper reports vertical Gallium nitride (GaN) PN diodes on free-standing GaN wafer using a complementary metal-oxide-semiconductor compatible contact materials. Static and switching current-voltage measurements have been carried out to evaluate the fabricated vertical GaN PN diodes. The vertical GaN PN diode in this paper shows turn-on voltage Von of 3.3-3.4 V, on/off current ratio of 2.7 × 107, and ideal factor n of 2.1. The reverse recovery time Trr is 21.2 ns and 23.2 ns, respectively, under a testing temperature of 300 K and 500 K. With an on-state resistance Ron of 3.9 m Ω cm2 and a breakdown voltage VBR of 2.4 kV, this device achieves a power device figure-of-merit VBR 2Ron of 1.5 × 109 V2 Ω-1 cm-2.

Original languageEnglish
Article number8417418
Pages (from-to)825-829
Number of pages5
JournalIEEE Journal of the Electron Devices Society
Volume6
DOIs
StatePublished - 20 07 2018

Bibliographical note

Publisher Copyright:
© 2013 IEEE.

Keywords

  • Free standing gallium nitride (GaN)
  • high breakdown voltage
  • power p-n diode

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