2.5D構裝體之熱變形量測與模擬

Translated title of the contribution: Measurement and Simulation of Thermal Deformation of 2.5D IC Packages
  • 劉家銘

Research output: Types of Thesis › Master's thesis

Translated title of the contributionMeasurement and Simulation of Thermal Deformation of 2.5D IC Packages
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2018
Externally publishedYes

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