Abstract
Chapter 1 shows the need to model the EM reliability of ULSI interconnects using 3D model at circuit layout level. In order to perform such modeling, a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.
Original language | English |
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Pages (from-to) | 7-47 |
Number of pages | 41 |
Journal | SpringerBriefs in Applied Sciences and Technology |
Issue number | 9789814451208 |
DOIs | |
State | Published - 2013 |
Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2013, The Author(s).