3D circuit model construction and simulation

Cher Ming Tan*, Feifei He

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

Abstract

Chapter 1 shows the need to model the EM reliability of ULSI interconnects using 3D model at circuit layout level. In order to perform such modeling, a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.

Original languageEnglish
Pages (from-to)7-47
Number of pages41
JournalSpringerBriefs in Applied Sciences and Technology
Issue number9789814451208
DOIs
StatePublished - 2013
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2013, The Author(s).

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