3D circuit model construction and simulation

Cher Ming Tan; Feifei He

doi:10.1007/978-981-4451-21-5_2

3D circuit model construction and simulation

Cher Ming Tan^*
, Feifei He

^*Corresponding author for this work

Nanyang Technological University

Research output: Contribution to journal › Journal Article › peer-review

Abstract

Chapter 1 shows the need to model the EM reliability of ULSI interconnects using 3D model at circuit layout level. In order to perform such modeling, a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.

Original language	English
Pages (from-to)	7-47
Number of pages	41
Journal	SpringerBriefs in Applied Sciences and Technology
Issue number	9789814451208
DOIs	https://doi.org/10.1007/978-981-4451-21-5_2
State	Published - 2013
Externally published	Yes

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Publisher Copyright:
© 2013, The Author(s).

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10.1007/978-981-4451-21-5_2

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abstract = "Chapter 1 shows the need to model the EM reliability of ULSI interconnects using 3D model at circuit layout level. In order to perform such modeling, a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.",

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AU - Tan, Cher Ming

AU - He, Feifei

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AB - Chapter 1 shows the need to model the EM reliability of ULSI interconnects using 3D model at circuit layout level. In order to perform such modeling, a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.

UR - https://www.scopus.com/pages/publications/85028882452

U2 - 10.1007/978-981-4451-21-5_2

DO - 10.1007/978-981-4451-21-5_2

M3 - 文章

AN - SCOPUS:85028882452

SN - 2191-530X

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EP - 47

JO - SpringerBriefs in Applied Sciences and Technology

JF - SpringerBriefs in Applied Sciences and Technology

IS - 9789814451208

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3D circuit model construction and simulation

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