3D circuit model for 3D IC reliability study

Engineering

• Temperature 100%
• Reliability Study 100%
• Circuit Model 100%
• Density 75%
• Networks (Circuits) 75%
• Models 50%
• Reliability 50%
• Interconnects 50%
• Three Dimensional Integrated Circuits 50%
• Electromigration 50%
• Properties 25%
• Semiconductor 25%
• Simulation Result 25%
• Simulation 25%
• Design 25%
• Demonstrates 25%
• Heating 25%
• Failure (Mechanical) 25%
• Young's Modulus 25%
• Elements 25%
• Thermal Conductivity 25%
• Integrated Circuit 25%
• Simulators 25%
• Compute 25%
• Poisson Ratio 25%
• Joule 25%
• Integrated Circuit Layout 25%

Physics

• Model 100%
• Temperature 100%
• Reliability 100%
• Simulation 66%
• Technology 66%
• Stress Distribution 66%
• Electromigration 66%
• Semiconductor 33%
• Heating 33%
• Modulus of Elasticity 33%
• Thermal Conductivity 33%
• Temperature Distribution 33%
• Failure 33%
• View 33%
• Poisson Ratio 33%
• Density Distribution 33%
• Finite Element Methods 33%
• Mechanical Stress 33%
• Heat Transfer 33%
• Mechanical Modelling 33%

Material Science

• Electronic Circuit 100%
• Temperature 50%
• Density 37%
• Semiconductor Material 12%
• Material 12%
• Materials Property 12%
• Thermal Conductivity 12%
• Poisson Ratio 12%
• Layout Design 12%