Abstract
Plasma-enhanced chemical vapor deposition is a process used to deposit SiNx film in thin film transistor array fabrication. It can prepare various nonstoichiometric films with tailored properties and be effective in developing high-quality film at low temperature; it also can deposit uniform films on a large-size substrate. In this paper, we present two variables sampling plans for product acceptance determination for multiple manufacturing lines. The first plan is based on a resubmitted scheme, and the second plan is based on an exponentially weighted moving average model with yield index. A new approach is developed to obtain the sample size and the acceptance value for various producer's risks and consumer's risks and various number of manufacturing lines. The proposed plans provide more economical sample size than the existing sampling plan and maintain the same protection for both producer and customer risks. The applications of proposed plans are given with the help of two industrial examples.
| Original language | English |
|---|---|
| Article number | 8103929 |
| Pages (from-to) | 317-325 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 8 |
| Issue number | 2 |
| DOIs | |
| State | Published - 02 2018 |
| Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
Keywords
- Exponentially weighted moving average (EWMA)
- resubmitted scheme
- sampling plan by variables
- yield index
