A New Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

Research output: Contribution to conference › Proceeding

Original language	American English
State	Published - 2007
Event	InterPack2007 - Vancouver, BC, Canada Duration: 08 07 2007 → 12 07 2007

Conference	InterPack2007
Period	08/07/07 → 12/07/07

Cite this

@conference{50a3e5106459479f8d99f57c172a9d22,

title = "A New Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging",

author = "Ming-Yi Tsai and Huang, \{C. Y.\} and C.Y. Chiang and Wu, \{C. Y.\} and Yang, \{S. S.\}",

year = "2007",

language = "American English",

note = "InterPack2007 ; Conference date: 08-07-2007 Through 12-07-2007",

}