A parallel coupled-line filter using VLSI backend interconnect with high resistivity substrate

C. C. Chen*, H. L. Kao, K. C. Chiang, Albert Chin

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

Abstract

This paper reports our progress in developing parallel coupled-line filters based on Si-based VLSI backend interconnects for millimeter-wave applications. The resonant frequency of this coupled-line filter increases with increasing spacing-gap and with increasing IDM thickness. By using high resistivity substrate, the parallel coupled-line band-pass filter is extremely effective in reducing substrate loss, and also provides very low insertion loss, even at the millimeter-wave regime. In addition, the parallel coupled-line filter suitable for advanced system-on-a-chips at the millimeter wave application achieves high performance characteristics, which show low insertion loss, wide band, and compatibility with standard VLSI process.

Original languageEnglish
Pages (from-to)91-103
Number of pages13
JournalInternational Journal of Infrared and Millimeter Waves
Volume27
Issue number1
DOIs
StatePublished - 01 2006
Externally publishedYes

Keywords

  • High resistivity substrate
  • Millimeter-wave
  • Parallel coupled-line filter
  • VLSI

Fingerprint

Dive into the research topics of 'A parallel coupled-line filter using VLSI backend interconnect with high resistivity substrate'. Together they form a unique fingerprint.

Cite this