| Translated title of the contribution | 用於先進積體電路技術互連節點中電遷移之實用3D建模工具 |
|---|---|
| Original language | American English |
| Supervisors/Advisors |
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| State | Published - 2023 |
| Externally published | Yes |
A Practical 3D modeling tool for Electromigration of interconnect in Advanced Integrated Circuit Technology Node
班納吉
Research output: Types of Thesis › Master's thesis