A remotely controlled locomotive IC driven by electrolytic bubbles and wireless powering

Po Hung Kuo, Jian Yu Hsieh, Yi Chun Huang, Yu Jie Huang, Rong Da Tsai, Tao Wang, Hung Wei Chiu, Shey Shi Lu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

As implantable medical CMOS devices become a reality [1], motion control of such implantable devices has become the next challenge in the advanced integrated micro-system domain. With integrated sensors and a controllable propulsion mechanism, a micro-system will be able to perform tumor scan, drug delivery, neuron stimulation, bio-test, etc, in a revolutionary way and with minimum injury. Such devices are especially suitable for human hollow organs, such as urinary bladder and stomach. Motivated by the art reported in ISSCC 2012 [2], we demonstrate a remotely-controlled locomotive CMOS IC which is realized in TSMC 0.35μm technology. As illustrated in Fig. 18.7.1, a bare CMOS chip flipped on a liquid surface can be moved to the desired position without any wire connections. Instead of Lorentz forces [2], this chip utilizes the gas pressure resulting from electrolytic bubbles as the propulsive force. By appointing voltages to the on-chip electrolysis electrodes, one can decide the electrolysis location and thereby control the bubbles emissions as well as the direction of motion. With power management circuits, wireless receiver and micro-control unit (MCU), the received signal can be exploited as the movement control as well as wireless power. Experiments show a moving speed of 0.3mm/s of this chip. The total size is 21.2mm2 and the power consumption of the integrated circuits and the electrolysis electrodes are 125.4μW and 82μW, respectively.

Original languageEnglish
Title of host publication2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages322-323
Number of pages2
ISBN (Print)9781479909186
DOIs
StatePublished - 2014
Event2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014 - San Francisco, CA, United States
Duration: 09 02 201413 02 2014

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume57
ISSN (Print)0193-6530

Conference

Conference2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014
Country/TerritoryUnited States
CitySan Francisco, CA
Period09/02/1413/02/14

Fingerprint

Dive into the research topics of 'A remotely controlled locomotive IC driven by electrolytic bubbles and wireless powering'. Together they form a unique fingerprint.

Cite this