A STEP-COMPATIBLE APPROACH for IC PACKAGING SCHEDULING SYSTEM

  • Thu Hua Liu
  • , Amy J.C. Trappey
  • , Fu Wei Chan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This research develops a Computer-Aided Scheduling System (CASS) for IC packaging industry. We adopt the concept and methods of STEP enabling technologies to model and implement the system. The effort aims to achieve integration of engineering applications by standardizing the modeling and the use of product data. This paper uses IDEFO to model the IC packaging scheduling process and, then, EXPRESS language to define the data models. The IC packaging scheduling system is implemented in an integrated environment using the object-oriented language (C++) and the object-oriented database (Objectstore). The ST-Developer is used as the kernel to interface the application language, the database, and the EXPRESS data models. The architecture of this integrated implementation environment is not only effective for scheduling task but also useful in general applications for product design, analysis and production plarming.

Original languageEnglish
Title of host publicationManufacturing Science and Engineering
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages633-648
Number of pages16
ISBN (Electronic)9780791815458
DOIs
StatePublished - 1996
EventASME 1996 International Mechanical Engineering Congress and Exposition, IMECE 1996 - Atlanta, United States
Duration: 17 11 199622 11 1996

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume1996-T

Conference

ConferenceASME 1996 International Mechanical Engineering Congress and Exposition, IMECE 1996
Country/TerritoryUnited States
CityAtlanta
Period17/11/9622/11/96

Bibliographical note

Publisher Copyright:
© 1996 American Society of Mechanical Engineers (ASME). All rights reserved.

Fingerprint

Dive into the research topics of 'A STEP-COMPATIBLE APPROACH for IC PACKAGING SCHEDULING SYSTEM'. Together they form a unique fingerprint.

Cite this