Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits

Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Complexities in the Integrated Circuits (ICs) is increasing rapidly, with close placing of various sub-circuits in a chip. The high operating frequency of the sub-circuits can affect one another if their placement is too close. This study helps to show a methodology to have an IC layout in terms of sub-circuits and components placement by reducing the impact of electromagnetic emission and interferences from one another.

Original languageEnglish
Title of host publication2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages81-87
Number of pages7
ISBN (Electronic)9781728114392
DOIs
StatePublished - 04 2019
Event2nd International Conference on Communication Engineering and Technology, ICCET 2019 - Nagoya, Japan
Duration: 12 04 201915 04 2019

Publication series

Name2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019

Conference

Conference2nd International Conference on Communication Engineering and Technology, ICCET 2019
Country/TerritoryJapan
CityNagoya
Period12/04/1915/04/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Keywords

  • electromagnetic emissions (EMEs)
  • gallium nitride high electron mobility transistor (GaN-HEMT)
  • near field measurement
  • radiated emissions

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