Abstract
Complexities in the Integrated Circuits (ICs) is increasing rapidly, with close placing of various sub-circuits in a chip. The high operating frequency of the sub-circuits can affect one another if their placement is too close. This study helps to show a methodology to have an IC layout in terms of sub-circuits and components placement by reducing the impact of electromagnetic emission and interferences from one another.
Original language | English |
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Title of host publication | 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 81-87 |
Number of pages | 7 |
ISBN (Electronic) | 9781728114392 |
DOIs | |
State | Published - 04 2019 |
Event | 2nd International Conference on Communication Engineering and Technology, ICCET 2019 - Nagoya, Japan Duration: 12 04 2019 → 15 04 2019 |
Publication series
Name | 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019 |
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Conference
Conference | 2nd International Conference on Communication Engineering and Technology, ICCET 2019 |
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Country/Territory | Japan |
City | Nagoya |
Period | 12/04/19 → 15/04/19 |
Bibliographical note
Publisher Copyright:© 2019 IEEE.
Keywords
- electromagnetic emissions (EMEs)
- gallium nitride high electron mobility transistor (GaN-HEMT)
- near field measurement
- radiated emissions