Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits

Vivek Sangwan; Dipesh Kapoor; Cher Ming Tan

doi:10.1109/ICCET.2019.8726894

Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits

Vivek Sangwan
, Dipesh Kapoor
, Cher Ming Tan

Department of Electronic Engineering

Chang Gung University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Complexities in the Integrated Circuits (ICs) is increasing rapidly, with close placing of various sub-circuits in a chip. The high operating frequency of the sub-circuits can affect one another if their placement is too close. This study helps to show a methodology to have an IC layout in terms of sub-circuits and components placement by reducing the impact of electromagnetic emission and interferences from one another.

Original language	English
Title of host publication	2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	81-87
Number of pages	7
ISBN (Electronic)	9781728114392
DOIs	https://doi.org/10.1109/ICCET.2019.8726894
State	Published - 04 2019
Event	2nd International Conference on Communication Engineering and Technology, ICCET 2019 - Nagoya, Japan Duration: 12 04 2019 → 15 04 2019

Publication series

Name	2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019

Conference

Conference	2nd International Conference on Communication Engineering and Technology, ICCET 2019
Country/Territory	Japan
City	Nagoya
Period	12/04/19 → 15/04/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Keywords

electromagnetic emissions (EMEs)
gallium nitride high electron mobility transistor (GaN-HEMT)
near field measurement
radiated emissions

Access to Document

10.1109/ICCET.2019.8726894

Cite this

Sangwan, V., Kapoor, D., & Tan, C. M. (2019). Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits. In 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019 (pp. 81-87). Article 8726894 (2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCET.2019.8726894

Sangwan, Vivek ; Kapoor, Dipesh ; Tan, Cher Ming. / Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits. 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 81-87 (2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019).

@inproceedings{01c458f40be44a4f8cbf63e74c802212,

title = "Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits",

abstract = "Complexities in the Integrated Circuits (ICs) is increasing rapidly, with close placing of various sub-circuits in a chip. The high operating frequency of the sub-circuits can affect one another if their placement is too close. This study helps to show a methodology to have an IC layout in terms of sub-circuits and components placement by reducing the impact of electromagnetic emission and interferences from one another.",

keywords = "electromagnetic emissions (EMEs), gallium nitride high electron mobility transistor (GaN-HEMT), near field measurement, radiated emissions",

author = "Vivek Sangwan and Dipesh Kapoor and Tan, \{Cher Ming\}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2nd International Conference on Communication Engineering and Technology, ICCET 2019 ; Conference date: 12-04-2019 Through 15-04-2019",

year = "2019",

month = apr,

doi = "10.1109/ICCET.2019.8726894",

language = "英语",

series = "2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "81--87",

booktitle = "2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019",

address = "美国",

}

Sangwan, V, Kapoor, D & Tan, CM 2019, Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits. in 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019., 8726894, 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019, Institute of Electrical and Electronics Engineers Inc., pp. 81-87, 2nd International Conference on Communication Engineering and Technology, ICCET 2019, Nagoya, Japan, 12/04/19. https://doi.org/10.1109/ICCET.2019.8726894

Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits. / Sangwan, Vivek; Kapoor, Dipesh; Tan, Cher Ming.
2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 81-87 8726894 (2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits

AU - Sangwan, Vivek

AU - Kapoor, Dipesh

AU - Tan, Cher Ming

PY - 2019/4

Y1 - 2019/4

N2 - Complexities in the Integrated Circuits (ICs) is increasing rapidly, with close placing of various sub-circuits in a chip. The high operating frequency of the sub-circuits can affect one another if their placement is too close. This study helps to show a methodology to have an IC layout in terms of sub-circuits and components placement by reducing the impact of electromagnetic emission and interferences from one another.

AB - Complexities in the Integrated Circuits (ICs) is increasing rapidly, with close placing of various sub-circuits in a chip. The high operating frequency of the sub-circuits can affect one another if their placement is too close. This study helps to show a methodology to have an IC layout in terms of sub-circuits and components placement by reducing the impact of electromagnetic emission and interferences from one another.

KW - electromagnetic emissions (EMEs)

KW - gallium nitride high electron mobility transistor (GaN-HEMT)

KW - near field measurement

KW - radiated emissions

UR - https://www.scopus.com/pages/publications/85067974248

U2 - 10.1109/ICCET.2019.8726894

DO - 10.1109/ICCET.2019.8726894

M3 - 会议稿件

AN - SCOPUS:85067974248

T3 - 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019

SP - 81

EP - 87

BT - 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2nd International Conference on Communication Engineering and Technology, ICCET 2019

Y2 - 12 April 2019 through 15 April 2019

ER -

Sangwan V, Kapoor D, Tan CM. Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits. In 2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 81-87. 8726894. (2019 2nd International Conference on Communication Engineering and Technology, ICCET 2019). doi: 10.1109/ICCET.2019.8726894

Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this