Additive-free electroless deposition on graphene/copper foil: Photo-induced and defect-assisted approach for environmentally friendly plating

The environmental toxicity of chemicals used in electroless plating process is often overlooked. In fact, the wastewater from the electroless plating process contains metal complexes, reducing agents and stabilizers that can create hazard to our environment. To address this concern, an additive-free electroless deposition process on graphene/Cu foil is proposed. The defect structure of graphene plays a pivotal role by acting as a reservoir for concentrating photoelectrons generated from ultra-thin cuprous oxide (Cu₂O) located at the interface of graphene and Cu foil upon exposure to light irradiation. In the Cu ion solution, Cu ions were anchored on the defect sites and formed a Cu-C₄ structure with graphene. The Cu-C₄ sites accumulate abundant photoelectrons and trigger the reduction of Cu ions to form island-like growth of Cu, which immediately was oxidized to Cu₂O, leaving only a small portion of metallic Cu. Concurrently, the presence of Cu ions induces the generation of additional defect sites on graphene, providing further growth sites for Cu deposition. This process continues until the entire graphene surface is covered by the deposited Cu₂O. Ultimately, the deposition of metallic oxides with lower redox potential can be achieved. The proposed deposition mechanism assisted by irradiation of photocatalyst and defect structure of graphene material provides a truly environmentally friendly electroless plating process. By eliminating the need for additives and significantly reducing the environmental hazards associated with electroless plating, this method holds great promise for sustainable materials manufacturing.