Alternating PSM for sub-60 nm DRAM gate single exposure

  • Kunyuan Chen*
  • , Richard Lu
  • , Kuo Kuei Fu
  • , Chung Ping Hsia
  • , Chiang Lin Shih
  • , Jeng Ping Lin
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The fast pattern shrinkage of DRAM has driven the lithography technology into the low k1 regime for sub-60 nm technology node. There are a lot of resolution enhancement techniques (RETs) e.g. OPC (Optical Proximity Correction), SB (Scattering Bar), SRAF (Sub-Resolution Assist Features) and DDL (Double Dipole Lithography) and Alternating PSM to enable the low k1 lithography [4]. However, among the RETs, the alternating PSM technique is a high cost solution because double exposure is needed to avoid phase conflict error. Therefore, the implementation of alternating PSM with single exposure for gate conductor layer is the main purpose of this study. Many kinds of pattern and phase designs in the main cell and periphery were investigated.

Original languageEnglish
Title of host publicationPhotomask Technology 2006
DOIs
StatePublished - 2006
Externally publishedYes
Event25th Annual BACUS Symposium on Photmask Technology 2006 - Monterey, CA, United States
Duration: 19 09 200622 09 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6349 II
ISSN (Print)0277-786X

Conference

Conference25th Annual BACUS Symposium on Photmask Technology 2006
Country/TerritoryUnited States
CityMonterey, CA
Period19/09/0622/09/06

Keywords

  • Alternating PSM
  • DDL (Double Dipole Lithography)
  • Exposure window (DOF)
  • NA
  • OPC (Optical Proximity Correction)
  • Phase conflict
  • SRAF (Sub-Resolution Assist Features)
  • k1

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