TY - GEN
T1 - An accuracy analysis of the steady-state thermal conductivity measurement method with single constant temperature region
AU - Sun, Ming Tsung
AU - Chang, Chin Hsiang
PY - 2003
Y1 - 2003
N2 - The newly developed method for steady-state thermal conductivity measurement with single constant temperature region is experimentally proven accurate within 3% compared with the guarded hot plate method. The method is suitable for in-situ nondestructive evaluation of insulation materials. However, there are factors that affect the accuracy of measurement yet to be closely studied. In this paper, we present a theoretical analysis of the accuracy of the method by varying the relative size of the heating plate, the thickness of the test specimen, the location of the temperature sensors at the lower temperature side, and different thermal convection coefficients for the free convection boundary condition. In the study, the temperature distribution in a homogeneous material is solved numerically. The thermal conductivity is evaluated from the temperature distribution and the heat flux measured according to the method. By comparing the results with that given in the numerical model, the accuracy can be expressed as functions of the three variables in the analysis. The results are consistent with that of the experiment. They are considered beneficial in providing information to the optimal design and the measurement correction of a commercialized apparatus using the method.
AB - The newly developed method for steady-state thermal conductivity measurement with single constant temperature region is experimentally proven accurate within 3% compared with the guarded hot plate method. The method is suitable for in-situ nondestructive evaluation of insulation materials. However, there are factors that affect the accuracy of measurement yet to be closely studied. In this paper, we present a theoretical analysis of the accuracy of the method by varying the relative size of the heating plate, the thickness of the test specimen, the location of the temperature sensors at the lower temperature side, and different thermal convection coefficients for the free convection boundary condition. In the study, the temperature distribution in a homogeneous material is solved numerically. The thermal conductivity is evaluated from the temperature distribution and the heat flux measured according to the method. By comparing the results with that given in the numerical model, the accuracy can be expressed as functions of the three variables in the analysis. The results are consistent with that of the experiment. They are considered beneficial in providing information to the optimal design and the measurement correction of a commercialized apparatus using the method.
UR - https://www.scopus.com/pages/publications/1842629519
U2 - 10.1115/ht2003-47429
DO - 10.1115/ht2003-47429
M3 - 会议稿件
AN - SCOPUS:1842629519
SN - 0791836932
SN - 9780791836934
T3 - Proceedings of the ASME Summer Heat Transfer Conference
SP - 125
EP - 128
BT - Proceedings of the 003 ASME Summer Heat Transfer Conference, Volume 1
PB - American Society of Mechanical Engineers
T2 - 2003 ASME Summer Heat Transfer Conference (HT2003)
Y2 - 21 July 2003 through 23 July 2003
ER -