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An alternative method to fabricate the planar-type resonant-cavity light-emitting diodes by using silicon oxide for short-reach communications

  • Chia Lung Tsai*
  • , Yi Lun Chou
  • , Ray Ming Lin
  • , Feng Ming Lee
  • , Meng Chyi Wu
  • , Sun Chien Ko
  • *Corresponding author for this work
  • National Tsing Hua University
  • Chunghwa Telecom Co. Ltd.

Research output: Contribution to journalJournal Article peer-review

3 Scopus citations

Abstract

In this article, the silicon oxide (SiOx) planarization technique is presented to fabricate the 650-nm resonant-cavity light-emitting diodes (RCLEDs). The performances of RCLEDs are characterized by forward voltage, light output power, external quantum efficiency, emission spectrum, and dynamic response. As a result, the device with the SiOx-planarized layer exhibits a low operating voltage of 2.3 V at 20 mA, a maximum light output power of 304 μW at 15 mA, and the best external quantum efficiency of 3% at 1.2 mA. In addition, the SiOx-planarized device exhibits temperature insensitivity as compared to the device without it. The RCLED with a 30-μm diameter shows the maximum 3 dB frequency bandwidth of 275 MHz at a driving current of 40 mA. Finally, the RCLED with a SiOx-planarized layer shows a clear eye-opening feature as operating at 100 Mbit/s at 20 mA. These results indicate that such LEDs are excellent candidates for use in high-speed short-reach plastic optical fiber communications.

Original languageEnglish
Pages (from-to)235-240
Number of pages6
JournalMaterials Science in Semiconductor Processing
Volume10
Issue number6
DOIs
StatePublished - 12 2007

Keywords

  • Resonant-cavity light-emitting diodes (RCLEDs)
  • Short-reach communication
  • SiO planarization process

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