Analysis of the back-barrier effect in AlGaN/GaN high electron mobility transistor on free-standing GaN substrates

  • Xinke Liu
  • , Hao Yu Wang
  • , Hsien Chin Chiu*
  • , Yuxuan Chen
  • , Dabing Li
  • , Chong Rong Huang
  • , Hsuan Ling Kao
  • , Hao Chung Kuo
  • , Sung Wen Huang Chen
  • *Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

39 Scopus citations

Abstract

The effect of AlGaN back-barrier on AlGaN/GaN high electron mobility transistors (HEMTs) using free-standing GaN wafer has been investigated in this work. With the introducing back-barrier structure, the leakage path underneath the buffer (native nitrogen-vacancies and GaOx compounds of the HVPE-grown free-standing GaN surface) layer can be suppressed by lift-up the conduction band. As compared with AlGaN/GaN HEMTs on SiC wafer, AlGaN/GaN HEMTs on free-standing GaN wafer show enhanced drain current (700 mA/mm), improved transconductance (143 mS/mm), less current collapse (12%), higher current gain cut-off frequency (13 GHz), and maximum stable gain cut-off frequency (24 GHz), which is attributed to the higher epi quality layer on free-standing GaN wafer.

Original languageEnglish
Article number152293
JournalJournal of Alloys and Compounds
Volume814
DOIs
StatePublished - 25 01 2020

Bibliographical note

Publisher Copyright:
© 2019 Elsevier B.V.

Keywords

  • Back barrier
  • GaN on GaN
  • HEMT
  • Microwave
  • Raman

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