Abstract
The effect of AlGaN back-barrier on AlGaN/GaN high electron mobility transistors (HEMTs) using free-standing GaN wafer has been investigated in this work. With the introducing back-barrier structure, the leakage path underneath the buffer (native nitrogen-vacancies and GaOx compounds of the HVPE-grown free-standing GaN surface) layer can be suppressed by lift-up the conduction band. As compared with AlGaN/GaN HEMTs on SiC wafer, AlGaN/GaN HEMTs on free-standing GaN wafer show enhanced drain current (700 mA/mm), improved transconductance (143 mS/mm), less current collapse (12%), higher current gain cut-off frequency (13 GHz), and maximum stable gain cut-off frequency (24 GHz), which is attributed to the higher epi quality layer on free-standing GaN wafer.
| Original language | English |
|---|---|
| Article number | 152293 |
| Journal | Journal of Alloys and Compounds |
| Volume | 814 |
| DOIs | |
| State | Published - 25 01 2020 |
Bibliographical note
Publisher Copyright:© 2019 Elsevier B.V.
Keywords
- Back barrier
- GaN on GaN
- HEMT
- Microwave
- Raman
Fingerprint
Dive into the research topics of 'Analysis of the back-barrier effect in AlGaN/GaN high electron mobility transistor on free-standing GaN substrates'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver