Anodic bonding using Gorilla Glasses

Chinghung Hsu; Gui Chen; Yen Heng Lin; Mark Ming Cheng Cheng

doi:10.1109/NEMS.2017.8017086

Anodic bonding using Gorilla Glasses

Chinghung Hsu, Gui Chen, Yen Heng Lin, Mark Ming Cheng Cheng^*

^*Corresponding author for this work

Department of Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

For the first time, this paper investigates anodic bonding using the latest chemically-strengthened glass called Gorilla Glass (from Corning). Gorilla Glass has many excellent properties for MEMS/NEMS applications, including hardness (resistance to scratching), flexibility, high fracture toughness and antibacterial resistance. However, the high thermal expansion coefficient of Gorilla Glass (7.58ppm/°C) makes it doubtful for anodic bonding, where high temperature (200∼4000C) and high electrical field are applied to facilitate silicon to glass bonding. We show that the presence of the potassium ions at the surfaces of Gloria Glass not only makes the glass more resistant to damage but also facilitates the process of anodic bonding (including lower bonding temperature and voltage). With the proper cooling conditions, it is also feasible to develop silicon-glass microstructures based on the principle of stress engineering.

Original language	English
Title of host publication	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	566-569
Number of pages	4
ISBN (Electronic)	9781509030590
DOIs	https://doi.org/10.1109/NEMS.2017.8017086
State	Published - 25 08 2017
Event	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States Duration: 09 04 2017 → 12 04 2017

Publication series

Name	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Conference

Conference	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Country/Territory	United States
City	Los Angeles
Period	09/04/17 → 12/04/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

Keywords

Anodic Bonding
Corning Gorilla Glass

Access to Document

10.1109/NEMS.2017.8017086

Cite this

Hsu, C., Chen, G., Lin, Y. H., & Cheng, M. M. C. (2017). Anodic bonding using Gorilla Glasses. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 (pp. 566-569). Article 8017086 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2017.8017086

@inproceedings{b87ed062a2a24f409359ebc68b1d3a6a,

title = "Anodic bonding using Gorilla Glasses",

abstract = "For the first time, this paper investigates anodic bonding using the latest chemically-strengthened glass called Gorilla Glass (from Corning). Gorilla Glass has many excellent properties for MEMS/NEMS applications, including hardness (resistance to scratching), flexibility, high fracture toughness and antibacterial resistance. However, the high thermal expansion coefficient of Gorilla Glass (7.58ppm/°C) makes it doubtful for anodic bonding, where high temperature (200∼4000C) and high electrical field are applied to facilitate silicon to glass bonding. We show that the presence of the potassium ions at the surfaces of Gloria Glass not only makes the glass more resistant to damage but also facilitates the process of anodic bonding (including lower bonding temperature and voltage). With the proper cooling conditions, it is also feasible to develop silicon-glass microstructures based on the principle of stress engineering.",

keywords = "Anodic Bonding, Corning Gorilla Glass",

author = "Chinghung Hsu and Gui Chen and Lin, {Yen Heng} and Cheng, {Mark Ming Cheng}",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 ; Conference date: 09-04-2017 Through 12-04-2017",

year = "2017",

month = aug,

day = "25",

doi = "10.1109/NEMS.2017.8017086",

language = "英语",

series = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "566--569",

booktitle = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",

address = "美国",

}

Hsu, C, Chen, G, Lin, YH & Cheng, MMC 2017, Anodic bonding using Gorilla Glasses. in 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017., 8017086, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Institute of Electrical and Electronics Engineers Inc., pp. 566-569, 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, United States, 09/04/17. https://doi.org/10.1109/NEMS.2017.8017086

Anodic bonding using Gorilla Glasses. / Hsu, Chinghung; Chen, Gui; Lin, Yen Heng et al.
2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 566-569 8017086 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Anodic bonding using Gorilla Glasses

AU - Hsu, Chinghung

AU - Chen, Gui

AU - Lin, Yen Heng

AU - Cheng, Mark Ming Cheng

PY - 2017/8/25

Y1 - 2017/8/25

N2 - For the first time, this paper investigates anodic bonding using the latest chemically-strengthened glass called Gorilla Glass (from Corning). Gorilla Glass has many excellent properties for MEMS/NEMS applications, including hardness (resistance to scratching), flexibility, high fracture toughness and antibacterial resistance. However, the high thermal expansion coefficient of Gorilla Glass (7.58ppm/°C) makes it doubtful for anodic bonding, where high temperature (200∼4000C) and high electrical field are applied to facilitate silicon to glass bonding. We show that the presence of the potassium ions at the surfaces of Gloria Glass not only makes the glass more resistant to damage but also facilitates the process of anodic bonding (including lower bonding temperature and voltage). With the proper cooling conditions, it is also feasible to develop silicon-glass microstructures based on the principle of stress engineering.

AB - For the first time, this paper investigates anodic bonding using the latest chemically-strengthened glass called Gorilla Glass (from Corning). Gorilla Glass has many excellent properties for MEMS/NEMS applications, including hardness (resistance to scratching), flexibility, high fracture toughness and antibacterial resistance. However, the high thermal expansion coefficient of Gorilla Glass (7.58ppm/°C) makes it doubtful for anodic bonding, where high temperature (200∼4000C) and high electrical field are applied to facilitate silicon to glass bonding. We show that the presence of the potassium ions at the surfaces of Gloria Glass not only makes the glass more resistant to damage but also facilitates the process of anodic bonding (including lower bonding temperature and voltage). With the proper cooling conditions, it is also feasible to develop silicon-glass microstructures based on the principle of stress engineering.

KW - Anodic Bonding

KW - Corning Gorilla Glass

UR - http://www.scopus.com/inward/record.url?scp=85030851364&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2017.8017086

DO - 10.1109/NEMS.2017.8017086

M3 - 会议稿件

AN - SCOPUS:85030851364

T3 - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

SP - 566

EP - 569

BT - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Y2 - 9 April 2017 through 12 April 2017

ER -

Hsu C, Chen G, Lin YH, Cheng MMC. Anodic bonding using Gorilla Glasses. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 566-569. 8017086. (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017). doi: 10.1109/NEMS.2017.8017086

Anodic bonding using Gorilla Glasses

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this