Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

J. H. Hsieh; T. H. Yeh; C. Li; C. H. Chiu; C. T. Huang

doi:10.1016/j.vacuum.2012.02.016

Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

J. H. Hsieh^*, T. H. Yeh, C. Li, C. H. Chiu, C. T. Huang

^*Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

42 Scopus citations

Abstract

TaN-(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(001). The films were then annealed using RTA (Rapid Thermal Annealing) at 200-400 °C to induce the nucleation and growth of metal particles in TaN matrix and on film surface. After the surface morphologies were analyzed, the samples were tested for their antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. It is found that the antibacterial efficiency against either E. coli or S. aureus can be much improved for TaN-(Ag,Cu), comparing with TaN-Ag or TaN-Cu films. The annealing temperature for TaN-(Ag,Cu) can be as low as 250 °C. Being annealed at this temperature, the film still shows good antibacterial behaviors against either bacterium. The synergistic effect due to the co-existence of Ag and Cu is obvious, while the films still shows good tribological behaviors.

Original language	English
Pages (from-to)	160-163
Number of pages	4
Journal	Vacuum
Volume	87
DOIs	https://doi.org/10.1016/j.vacuum.2012.02.016
State	Published - 2013
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2012 Elsevier Ltd.

Keywords

Antibacterial properties
Co-sputtering
Nanocomposite thin films
TaN-(Ag Cu)

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10.1016/j.vacuum.2012.02.016

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title = "Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films",

abstract = "TaN-(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(001). The films were then annealed using RTA (Rapid Thermal Annealing) at 200-400 °C to induce the nucleation and growth of metal particles in TaN matrix and on film surface. After the surface morphologies were analyzed, the samples were tested for their antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. It is found that the antibacterial efficiency against either E. coli or S. aureus can be much improved for TaN-(Ag,Cu), comparing with TaN-Ag or TaN-Cu films. The annealing temperature for TaN-(Ag,Cu) can be as low as 250 °C. Being annealed at this temperature, the film still shows good antibacterial behaviors against either bacterium. The synergistic effect due to the co-existence of Ag and Cu is obvious, while the films still shows good tribological behaviors.",

keywords = "Antibacterial properties, Co-sputtering, Nanocomposite thin films, TaN-(Ag Cu)",

author = "Hsieh, {J. H.} and Yeh, {T. H.} and C. Li and Chiu, {C. H.} and Huang, {C. T.}",

note = "Publisher Copyright: {\textcopyright} 2012 Elsevier Ltd.",

year = "2013",

doi = "10.1016/j.vacuum.2012.02.016",

language = "英语",

volume = "87",

pages = "160--163",

journal = "Vacuum",

issn = "0042-207X",

publisher = "Elsevier Ltd",

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TY - JOUR

T1 - Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

AU - Hsieh, J. H.

AU - Yeh, T. H.

AU - Li, C.

AU - Chiu, C. H.

AU - Huang, C. T.

PY - 2013

Y1 - 2013

N2 - TaN-(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(001). The films were then annealed using RTA (Rapid Thermal Annealing) at 200-400 °C to induce the nucleation and growth of metal particles in TaN matrix and on film surface. After the surface morphologies were analyzed, the samples were tested for their antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. It is found that the antibacterial efficiency against either E. coli or S. aureus can be much improved for TaN-(Ag,Cu), comparing with TaN-Ag or TaN-Cu films. The annealing temperature for TaN-(Ag,Cu) can be as low as 250 °C. Being annealed at this temperature, the film still shows good antibacterial behaviors against either bacterium. The synergistic effect due to the co-existence of Ag and Cu is obvious, while the films still shows good tribological behaviors.

AB - TaN-(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(001). The films were then annealed using RTA (Rapid Thermal Annealing) at 200-400 °C to induce the nucleation and growth of metal particles in TaN matrix and on film surface. After the surface morphologies were analyzed, the samples were tested for their antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. It is found that the antibacterial efficiency against either E. coli or S. aureus can be much improved for TaN-(Ag,Cu), comparing with TaN-Ag or TaN-Cu films. The annealing temperature for TaN-(Ag,Cu) can be as low as 250 °C. Being annealed at this temperature, the film still shows good antibacterial behaviors against either bacterium. The synergistic effect due to the co-existence of Ag and Cu is obvious, while the films still shows good tribological behaviors.

KW - Antibacterial properties

KW - Co-sputtering

KW - Nanocomposite thin films

KW - TaN-(Ag Cu)

UR - http://www.scopus.com/inward/record.url?scp=84877583072&partnerID=8YFLogxK

U2 - 10.1016/j.vacuum.2012.02.016

DO - 10.1016/j.vacuum.2012.02.016

M3 - 文章

AN - SCOPUS:84877583072

SN - 0042-207X

VL - 87

SP - 160

EP - 163

JO - Vacuum

JF - Vacuum

ER -

Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

Abstract

Bibliographical note

Keywords

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