Translated title of the contribution | To Evaluate the Solder Ball Shear Test for BGA Packages and Related Parameter Effects on the Shear Strength |
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Original language | Chinese (Traditional) |
Supervisors/Advisors |
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State | Published - 2022 |
Externally published | Yes |
BGA封裝體錫球之剪力強度測試與其有關影響參數之研究
陳威佑
Research output: Types of Thesis › Master's thesis