BGA封裝體錫球之剪力強度測試與其有關影響參數之研究

Translated title of the contribution: To Evaluate the Solder Ball Shear Test for BGA Packages and Related Parameter Effects on the Shear Strength

陳威佑

Research output: Types of ThesisMaster's thesis

Translated title of the contributionTo Evaluate the Solder Ball Shear Test for BGA Packages and Related Parameter Effects on the Shear Strength
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2022
Externally publishedYes

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