Blech effect in Cu interconnects with oxide and low-k dielectrics

Yuejin Hou*, Cher Ming Tan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations
Original languageEnglish
Title of host publicationProceedings of the 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2007
Pages65-69
Number of pages5
DOIs
StatePublished - 2007
Externally publishedYes
Event2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Bangalore, India
Duration: 11 07 200713 07 2007

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Country/TerritoryIndia
CityBangalore
Period11/07/0713/07/07

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