Boiling of enhanced surfaces at high heat fluxes in a small boiler

Liang Han Chien*, C. W. Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

High operating heat fluxes and small boiling space are the two major challenges to apply boiling heat transfer in electronics cooling. This experimental study seeks to find a good boiling performance surface that is suitable for cooling a CPU dissipating up to 88 W through a 14 mm × 14 mm surface area in a 15 mm × 54mm × 54mm vessel. Three structured boiling surfaces and three porous surfaces were tested in water at 60°C pool temperature. The experimental data showed that the best cross-grooved surface and the best porous surface have similar boiling performance curves. The evaporation resistances of these two surfaces vary from 0.12 to 0.26 K/W. The minimum evaporation resistance of the best cross-grooved surface was 0.125 K/W at 86.5 W. Because the evaporator area is much smaller than the condenser or the heat sink area, the thermal resistance is dominated by the evaporator. The condensation resistance of the 54mm × 54mm condensing area varies from 0.01 to 0.022 K/W, which is much smaller than the evaporation resistance of every boiling surface in the present test.

Original languageEnglish
Title of host publicationProceedings of the ASME Summer Heat Transfer Conference, HT 2005
Pages1003-1010
Number of pages8
DOIs
StatePublished - 2005
Externally publishedYes
Event2005 ASME Summer Heat Transfer Conference, HT 2005 - San Francisco, CA, United States
Duration: 17 07 200522 07 2005

Publication series

NameProceedings of the ASME Summer Heat Transfer Conference
Volume2

Conference

Conference2005 ASME Summer Heat Transfer Conference, HT 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/07/0522/07/05

Keywords

  • Boiling
  • Condensation
  • Cooling copyright © 2005 by asme
  • Evaporation
  • Porous
  • Thermal Resistance

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