@inproceedings{1373471811cf41889a3bc1a004e8256e,
title = "Boiling of enhanced surfaces at high heat fluxes in a small boiler",
abstract = "High operating heat fluxes and small boiling space are the two major challenges to apply boiling heat transfer in electronics cooling. This experimental study seeks to find a good boiling performance surface that is suitable for cooling a CPU dissipating up to 88 W through a 14 mm × 14 mm surface area in a 15 mm × 54mm × 54mm vessel. Three structured boiling surfaces and three porous surfaces were tested in water at 60°C pool temperature. The experimental data showed that the best cross-grooved surface and the best porous surface have similar boiling performance curves. The evaporation resistances of these two surfaces vary from 0.12 to 0.26 K/W. The minimum evaporation resistance of the best cross-grooved surface was 0.125 K/W at 86.5 W. Because the evaporator area is much smaller than the condenser or the heat sink area, the thermal resistance is dominated by the evaporator. The condensation resistance of the 54mm × 54mm condensing area varies from 0.01 to 0.022 K/W, which is much smaller than the evaporation resistance of every boiling surface in the present test.",
keywords = "Boiling, Condensation, Cooling copyright {\textcopyright} 2005 by asme, Evaporation, Porous, Thermal Resistance",
author = "Chien, {Liang Han} and Chen, {C. W.}",
year = "2005",
doi = "10.1115/IPACK2005-73457",
language = "英语",
isbn = "0791847314",
series = "Proceedings of the ASME Summer Heat Transfer Conference",
pages = "1003--1010",
booktitle = "Proceedings of the ASME Summer Heat Transfer Conference, HT 2005",
note = "2005 ASME Summer Heat Transfer Conference, HT 2005 ; Conference date: 17-07-2005 Through 22-07-2005",
}