TY - JOUR
T1 - Bump and underfill effects on thermal behaviors of flip-chip LED packages
T2 - Measurement and modeling
AU - Tsai, Ming Yi
AU - Tang, Chung Yi
AU - Yen, Chia Yi
AU - Chang, Liann Be
PY - 2014/3
Y1 - 2014/3
N2 - The goal of this paper is to experimentally and numerically study the thermal behaviors of flip-chip (FC) light-emitting diode (LED) packages with and without underfills and, furthermore, to compare it with conventional wire-bonding LED packages in order to understand its thermal dissipation mechanism. In experimental analyses, the junction temperature Tj and surface temperatures are measured by a junction temperature tester, thermal couples, and an infrared thermal imager, whereas the numerical analysis is carried out by an ANSYS simulation. After the validation of the simulation model with experimental results, the effects of FC bump number and underfill thermal conductivity on both Tj and thermal resistance Rth of the packages are investigated by this validated model. Furthermore, a simple model of effective thermal conductivity for a composite material of bumps and underfills is proposed for thermal analysis of the FCLED packages. Thermal results for the packages are presented and discussed in terms of volume fraction and thermal conductivity for bumps and underfills in this paper.
AB - The goal of this paper is to experimentally and numerically study the thermal behaviors of flip-chip (FC) light-emitting diode (LED) packages with and without underfills and, furthermore, to compare it with conventional wire-bonding LED packages in order to understand its thermal dissipation mechanism. In experimental analyses, the junction temperature Tj and surface temperatures are measured by a junction temperature tester, thermal couples, and an infrared thermal imager, whereas the numerical analysis is carried out by an ANSYS simulation. After the validation of the simulation model with experimental results, the effects of FC bump number and underfill thermal conductivity on both Tj and thermal resistance Rth of the packages are investigated by this validated model. Furthermore, a simple model of effective thermal conductivity for a composite material of bumps and underfills is proposed for thermal analysis of the FCLED packages. Thermal results for the packages are presented and discussed in terms of volume fraction and thermal conductivity for bumps and underfills in this paper.
KW - Flip chip (FC)
KW - Thermal resistance
KW - junction temperature
KW - light-emitting diode (LED)
UR - https://www.scopus.com/pages/publications/84896461084
U2 - 10.1109/TDMR.2013.2248365
DO - 10.1109/TDMR.2013.2248365
M3 - 文章
AN - SCOPUS:84896461084
SN - 1530-4388
VL - 14
SP - 161
EP - 168
JO - IEEE Transactions on Device and Materials Reliability
JF - IEEE Transactions on Device and Materials Reliability
IS - 1
M1 - 6471193
ER -