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Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification

  • M. X. Gu*
  • , T. C. Au Yeung
  • , C. M. Tan
  • , V. Nosik
  • *Corresponding author for this work
  • Nanyang Technological University
  • STMicroelectronics

Research output: Contribution to journalJournal Article peer-review

5 Scopus citations

Abstract

The impact of bond order loss of surface atoms on thermal conductivity of cylindrical silicon nanowires has been examined using the isotropic elastic continuum model. A core-shell structure with a modified Young's modulus in the surface skin of the wire has been used. Thermal conductivity is calculated from modified phonon dispersion relations based on recent developed bond-order-length-strength (BOLS) correlation. This work extends the previous linear approximation [Yeung Phys. Rev. B 74, 155317 (2006)] to calculate the phonon dispersion relation of torsional mode and longitudinal mode using the nonlinear approach. A significant increase in thermal conductivity is found compared to the case without using BOLS correlation.

Original languageEnglish
Article number094304
JournalJournal of Applied Physics
Volume100
Issue number9
DOIs
StatePublished - 2006
Externally publishedYes

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