Characterization of thermal and optical behaviors of flip-chip LED packages with various underfills

C. Y. Tang, M. Y. Tsai*, C. Y. Yen, L. B. Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

The goal of this study is to experimentally and numerically study the thermal and optical behaviors of flip-chip (FC) LED packages with and without underfill. For thermal characterization, the junction temperature (T j) and thermal resistance (R th) are evaluated experimentally by a junction temperature tester and an infrared thermal imager, and numerically by ANSYS simulation. After the simulation model validation, the effect of bu mp number and underfill thermal conductivity on T j and R th was further investigated. For optical characterization, the light output of the packages are measured by an integrating sphere system and calculated by TracePro commercial software. Both thermal and optical results for these packages will be presented and discussed in terms of parameters such as number of bumps and underfill in this paper.

Original languageEnglish
Title of host publication2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
Pages327-331
Number of pages5
DOIs
StatePublished - 2011
Event2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 - Taipei, Taiwan
Duration: 18 10 201121 10 2011

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
Country/TerritoryTaiwan
CityTaipei
Period18/10/1121/10/11

Keywords

  • Flip-chip
  • Junction temperature
  • LED
  • Light output
  • Thermal resistance
  • Underfill

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