@inproceedings{bf1b0d8cbef341b6acbbb1a21e31d6af,
title = "Characterization of thermal and optical behaviors of flip-chip LED packages with various underfills",
abstract = "The goal of this study is to experimentally and numerically study the thermal and optical behaviors of flip-chip (FC) LED packages with and without underfill. For thermal characterization, the junction temperature (T j) and thermal resistance (R th) are evaluated experimentally by a junction temperature tester and an infrared thermal imager, and numerically by ANSYS simulation. After the simulation model validation, the effect of bu mp number and underfill thermal conductivity on T j and R th was further investigated. For optical characterization, the light output of the packages are measured by an integrating sphere system and calculated by TracePro commercial software. Both thermal and optical results for these packages will be presented and discussed in terms of parameters such as number of bumps and underfill in this paper.",
keywords = "Flip-chip, Junction temperature, LED, Light output, Thermal resistance, Underfill",
author = "Tang, {C. Y.} and Tsai, {M. Y.} and Yen, {C. Y.} and Chang, {L. B.}",
year = "2011",
doi = "10.1109/IMPACT.2011.6117275",
language = "英语",
isbn = "9781457713880",
series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",
pages = "327--331",
booktitle = "2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011",
note = "2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 ; Conference date: 18-10-2011 Through 21-10-2011",
}