Characterizing reverse-bias electroluminescence of InGaN/GaN LEDs

  • Hsiang Chen*
  • , Chyuan Haur Kao
  • , Tien Chang Lu
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The reverse-bias operation of the InGaN LED device can shed a light on device reliability problems. Our goal is to use X-ray fluorescent (XRF) element analysis, 2D electroluminescence (EL) observations, and electrical measurements to visualize the current leakage and evaluate the fresh device performance. Hot electron- induced emissions due to a leakage current may be a mechanism of the reverse-bias emission. The reverse-bias light emission is relevant to reliability problems because of its combination of optical characterization and electrical performance. Besides, a nondestructive screening method has been built to detect the leakage current path around the metal contact and evaluate fresh LED device quality.

Original languageEnglish
Title of host publication2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011
StatePublished - 2011
Event2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011 - Palm Springs, CA, United States
Duration: 16 05 201119 05 2011

Publication series

Name2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011

Conference

Conference2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011
Country/TerritoryUnited States
CityPalm Springs, CA
Period16/05/1119/05/11

Keywords

  • Electroluminescence
  • Hot carrier induced emission
  • Ingan led
  • Leakage current
  • Reverse bias luminescence

Fingerprint

Dive into the research topics of 'Characterizing reverse-bias electroluminescence of InGaN/GaN LEDs'. Together they form a unique fingerprint.

Cite this