CMOS-compatible electrochemical process for RF CMOS inductors

L. Y. Ding, T. Wang, Y. C. Hu, W. P. Shih, S. S. Lu, P. Z. Chang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

This paper demonstrates a CMOS-compatible electrochemical etching process to reduce effectively the substrate loss which parasitizes RF CMOS inductors while maintains the mechanical support of silicon substrate. The advantages of this post-process are CMOS-compatible and mask-less that decreases substantially the difficulty and the cost of fabrication. The result presents that the quality factor of RF CMOS inductor is enhanced 100 % at 9.8 GHz through this post-process. In addition, this technique could advance the development of SOC (system on a chip) and the applications of RF CMOS circuit.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages2118-2121
Number of pages4
DOIs
StatePublished - 2009
Externally publishedYes
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 21 06 200925 06 2009

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/TerritoryUnited States
CityDenver, CO
Period21/06/0925/06/09

Keywords

  • CMOS-MEMS
  • CMOS-compatible
  • Electrochemical etching
  • Porous silicon

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