Abstract
This work designs miniaturized stub-type microstrip bandpass filters and develops a novel vertical interconnection scheme in a multilayer structure to design vertically folded filters for size reduction. The current study exploits the fabrication process of low-temperature cofired ceramic (LTCC) for filter realization and fabricates two LTCC Chebyshev stub-type filters at 28 GHz and 5.8 GHz to verify effectiveness of the proposed structure with a maximum size reduction of 50%. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:1389-1394, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26024
| Original language | English |
|---|---|
| Pages (from-to) | 1389-1394 |
| Number of pages | 6 |
| Journal | Microwave and Optical Technology Letters |
| Volume | 53 |
| Issue number | 6 |
| DOIs | |
| State | Published - 06 2011 |
Keywords
- LTCC filter
- bandpass filter
- folded structure
- vertical interconnection
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