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Compact LTCC bandpass filter with vertically folded structure

  • Kuo Sheng Chin*
  • , Jian Luen Hung
  • , Chun Wei Huang
  • , Jeffrey S. Fu
  • , Nemai C. Karmakar
  • *Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

5 Scopus citations

Abstract

This work designs miniaturized stub-type microstrip bandpass filters and develops a novel vertical interconnection scheme in a multilayer structure to design vertically folded filters for size reduction. The current study exploits the fabrication process of low-temperature cofired ceramic (LTCC) for filter realization and fabricates two LTCC Chebyshev stub-type filters at 28 GHz and 5.8 GHz to verify effectiveness of the proposed structure with a maximum size reduction of 50%. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:1389-1394, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26024

Original languageEnglish
Pages (from-to)1389-1394
Number of pages6
JournalMicrowave and Optical Technology Letters
Volume53
Issue number6
DOIs
StatePublished - 06 2011

Keywords

  • LTCC filter
  • bandpass filter
  • folded structure
  • vertical interconnection

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