Abstract
This paper examines a high-k dielectric material used as a flash memory charge trapping layer. Specifically, the addition Ti into a Gd2O3 film trapping layer and placed under different RTA is compared with Gd2O3 samples, and the physical and electrical characterizations of different MOHOS-type memory structures are compared. Our research shows a faster program/erase speed and larger memory window resulting from the Gd2TiO5 trapping layer due to its increased charge capture density. Furthermore, a structure comprised of Al/SiO2/Gd2TiO5/SiO2/Si annealed at 900°C in O2 ambient for 30 s demonstrated superior electrical characteristics. Our research indicates that memory devices using Gd2TiO5 with post-annealing treatment show promise for future flash memory applications.
| Original language | English |
|---|---|
| Pages (from-to) | 74-79 |
| Number of pages | 6 |
| Journal | Vacuum |
| Volume | 118 |
| DOIs | |
| State | Published - 01 08 2015 |
Bibliographical note
Publisher Copyright:© 2015 Elsevier Ltd. All rights reserved.
Keywords
- GdTixOy based memory
- High k dielectric
- MOHOS capacitors