Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation

Liann Be Chang; Ke Wei Pan; Chia Yi Yen; Ming Jer Jeng; Chun Te Wu; Sung Cheng Hu; Yang Kuao Kuo

doi:10.1016/j.tsf.2014.03.033

Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation

Liann Be Chang, Ke Wei Pan, Chia Yi Yen, Ming Jer Jeng^*, Chun Te Wu, Sung Cheng Hu, Yang Kuao Kuo

^*Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

7 Scopus citations

Abstract

Traditional white light light-emitting diode (LED) encapsulation is performed by mixed phosphors and silicone coating on LED die. However, this encapsulation with silicone coating incurs overheated temperatures and yellowing problem. Therefore, this work attempts to replace silicone paste by using spin-on-glass (SOG) materials. Experimental results indicate that although initial brightness of SOG-based packaging is lower than that of silicone packaging, its light attenuation is significantly lower than that of silicone for a long lighting time. After the LED power is turned on for 12 h, the brightness of LED with silicone and SOG material packaging decreases from 84 to 48 lm and 73 to 59 lm, respectively. Therefore, SOG material provides an alternative packaging solution for high power LED lighting applications.

Original language	English
Pages (from-to)	496-499
Number of pages	4
Journal	Thin Solid Films
Volume	570
Issue number	PB
DOIs	https://doi.org/10.1016/j.tsf.2014.03.033
State	Published - 03 11 2014

Bibliographical note

Publisher Copyright:
© 2014 Elsevier B.V.

Keywords

Encapsulation Phosphor
Light-emitting diode (LED)
Silicone Spin-on-glass (SOG)

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10.1016/j.tsf.2014.03.033

Cite this

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title = "Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation",

abstract = "Traditional white light light-emitting diode (LED) encapsulation is performed by mixed phosphors and silicone coating on LED die. However, this encapsulation with silicone coating incurs overheated temperatures and yellowing problem. Therefore, this work attempts to replace silicone paste by using spin-on-glass (SOG) materials. Experimental results indicate that although initial brightness of SOG-based packaging is lower than that of silicone packaging, its light attenuation is significantly lower than that of silicone for a long lighting time. After the LED power is turned on for 12 h, the brightness of LED with silicone and SOG material packaging decreases from 84 to 48 lm and 73 to 59 lm, respectively. Therefore, SOG material provides an alternative packaging solution for high power LED lighting applications.",

keywords = "Encapsulation Phosphor, Light-emitting diode (LED), Silicone Spin-on-glass (SOG)",

author = "Chang, {Liann Be} and Pan, {Ke Wei} and Yen, {Chia Yi} and Jeng, {Ming Jer} and Wu, {Chun Te} and Hu, {Sung Cheng} and Kuo, {Yang Kuao}",

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doi = "10.1016/j.tsf.2014.03.033",

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T1 - Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation

AU - Chang, Liann Be

AU - Pan, Ke Wei

AU - Yen, Chia Yi

AU - Jeng, Ming Jer

AU - Wu, Chun Te

AU - Hu, Sung Cheng

AU - Kuo, Yang Kuao

PY - 2014/11/3

Y1 - 2014/11/3

N2 - Traditional white light light-emitting diode (LED) encapsulation is performed by mixed phosphors and silicone coating on LED die. However, this encapsulation with silicone coating incurs overheated temperatures and yellowing problem. Therefore, this work attempts to replace silicone paste by using spin-on-glass (SOG) materials. Experimental results indicate that although initial brightness of SOG-based packaging is lower than that of silicone packaging, its light attenuation is significantly lower than that of silicone for a long lighting time. After the LED power is turned on for 12 h, the brightness of LED with silicone and SOG material packaging decreases from 84 to 48 lm and 73 to 59 lm, respectively. Therefore, SOG material provides an alternative packaging solution for high power LED lighting applications.

AB - Traditional white light light-emitting diode (LED) encapsulation is performed by mixed phosphors and silicone coating on LED die. However, this encapsulation with silicone coating incurs overheated temperatures and yellowing problem. Therefore, this work attempts to replace silicone paste by using spin-on-glass (SOG) materials. Experimental results indicate that although initial brightness of SOG-based packaging is lower than that of silicone packaging, its light attenuation is significantly lower than that of silicone for a long lighting time. After the LED power is turned on for 12 h, the brightness of LED with silicone and SOG material packaging decreases from 84 to 48 lm and 73 to 59 lm, respectively. Therefore, SOG material provides an alternative packaging solution for high power LED lighting applications.

KW - Encapsulation Phosphor

KW - Light-emitting diode (LED)

KW - Silicone Spin-on-glass (SOG)

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EP - 499

JO - Thin Solid Films

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Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation

Abstract

Bibliographical note

Keywords

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