Computer-aided design on the VLSI 45 C- mask compaction

W. S. Feng; W. T. Yang; M. Y. Hsieh

Computer-aided design on the VLSI 45 C- mask compaction

W. S. Feng^*, W. T. Yang, M. Y. Hsieh

^*Corresponding author for this work

National Taiwan University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.

Original language	English
Title of host publication	Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)
Editors	Anon
Publisher	Publ by IEEE
Pages	750-753
Number of pages	4
ISBN (Print)	0780312333
State	Published - 1993
Externally published	Yes
Event	Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5) - Beijing, China Duration: 19 10 1993 → 21 10 1993

Publication series

Name	Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)

Conference

Conference	Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5)
City	Beijing, China
Period	19/10/93 → 21/10/93

Cite this

@inproceedings{c0869978da1f45a4a9277b9b98910bbc,

title = "Computer-aided design on the VLSI 45 C- mask compaction",

abstract = "In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.",

author = "Feng, {W. S.} and Yang, {W. T.} and Hsieh, {M. Y.}",

year = "1993",

language = "英语",

isbn = "0780312333",

series = "Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)",

publisher = "Publ by IEEE",

pages = "750--753",

editor = "Anon",

booktitle = "Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)",

note = "Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5) ; Conference date: 19-10-1993 Through 21-10-1993",

}

Feng, WS, Yang, WT & Hsieh, MY 1993, Computer-aided design on the VLSI 45 C- mask compaction. in Anon (ed.), Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93). Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93), Publ by IEEE, pp. 750-753, Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5), Beijing, China, 19/10/93.

Computer-aided design on the VLSI 45 C- mask compaction. / Feng, W. S.; Yang, W. T.; Hsieh, M. Y.
Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93). ed. / Anon. Publ by IEEE, 1993. p. 750-753 (Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Computer-aided design on the VLSI 45 C- mask compaction

AU - Feng, W. S.

AU - Yang, W. T.

AU - Hsieh, M. Y.

PY - 1993

Y1 - 1993

N2 - In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.

AB - In this paper, we combine 1-D compaction with reshaping -a new action, to improve the result of compaction. Our algorithms change layout elements' shapes automatically according to some criteria and make neighboring layout elements' shapes as similar as possible. The more similar they are, the more compactable space we can obtain. The main part of our compaction is reshaping. If elements of certain 45 degrees layout can be reassigned their geometric shapes, we reshape them in order to gain more compactable space. Some experimental results of this 45 degree compactor with and without reshaping of both Manhattan and nonManhattan-45 degree layouts are shown.

UR - http://www.scopus.com/inward/record.url?scp=0027758450&partnerID=8YFLogxK

M3 - 会议稿件

AN - SCOPUS:0027758450

SN - 0780312333

T3 - Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)

SP - 750

EP - 753

BT - Proc 1993 IEEE Reg 10 Conf Comput Commun Control Power Eng (TENCON '93)

A2 - Anon, null

PB - Publ by IEEE

T2 - Proceedings of the 1993 IEEE Region 10 Conference on Computer, Communication, Control aand Power Engineering. Part 3 (of 5)

Y2 - 19 October 1993 through 21 October 1993

ER -

Computer-aided design on the VLSI 45 C- mask compaction

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