@inproceedings{c26f14a5b282449bae1fb960ade9c8e8,
title = "Control factor selection and solder residue problem study in flip chip process",
abstract = "In this paper, the solder residue problem is studied. The control factors are discussed to select the essential factors that affect the flip chip process. Pad type, pad size, open shape and opening gap are selected as the four essential factors to be discussed. The objective problems for discussion are the beads quantity and beads size. Experimental results reveal that the overall problem has been successfully formulated and described.",
keywords = "IC manufacturing process, Solder bead, Solder residue",
author = "Kuo, {Jian Long} and Kuo, {Chun Cheng}",
year = "2011",
doi = "10.4028/www.scientific.net/AMR.154-155.1804",
language = "英语",
isbn = "9780878492046",
series = "Advanced Materials Research",
pages = "1804--1812",
booktitle = "Materials Processing Technologies",
note = "2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 ; Conference date: 06-11-2010 Through 08-11-2010",
}